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Laser Marking Enters the ‘Full-Scale Era’—KeyGree’s Technological Breakthrough Drives Industrial Upgrades in Rail Transit and Structural Steel
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Laser Marking Enters the ‘Full-Scale Era’—KeyGree’s Technological Breakthrough Drives Industrial Upgrades in Rail Transit and Structural Steel

2025-08-07

KeyGree large-format laser marking machines represent the cutting edge of industrial laser marking technology, excelling in precision, efficiency, and material compatibility. Particularly suited for permanent marking on oversized workpieces (≥1.5m×1.5m), they are widely adopted in automotive,and consumer electronics sectors. This paper delves into KeyGree's technological breakthroughs across optical systems, motion control, material adaptability, and smart functionalities, supported by industrial case studies.

1. High-Stability Optical System

KeyGree employs modular fiber lasers (1064nm/355nm可选) with beam shaping  to achieve near-diffraction-limited output (M²≤1.2). Key innovations include:

  • Dynamic Focus Compensation: Piezo-driven Z-axis adjustment maintains ±3μm焦点直径 over 1.8m×1.2m working area.

  • Multi-Wavelength Coupling: Coaxial IR/UV output enables hybrid material processing, with <0.1ms wavelength switching and <5% contrast variation.

  • Thermal-Resistant Optics: Silicon carbide mirror mounts reduce drift to <0.02mrad after 8-hour operation.

大幅面激光打标机.jpg

2. Multi-Axis Motion Control

  • Magnetic Levitation Galvo: 20m/s scan speed, ±5μrad accuracy, cuts battery case marking time to 0.8s.

  • Adaptive Path Planning: B-spline algorithm compensates curvature-induced speed loss, boosting efficiency by 18%.

  • EtherCAT Synchronization: <0.5μs timing error ensures ±20μm repeatability across 3m×2m areas.

3. Material Compatibility & Process Library

  • High-Reflectivity Metals: PULSE shaping boosts copper absorption to >60% at 0.8J/cm².

  • Brittle Materials: UV laser + AOM achieves <15μm line width on sapphire with <2μm edge chipping.

  • In-Process QC: CCD vision monitors depth (±2μm) and contrast, reducing defects to 0.3%.

4. Smart Manufacturing Integration

KeyOS 3.0 supports:

  • Digital Twin Simulation: Collision avoidance pre-validation.

  • Remote O&M: 5G-enabled predictive maintenance (≥95% accuracy).

  • MES Connectivity: Auto-marking of serial numbers cut labor costs by 40% for a home appliance OEM.

Case Studies

  • EV Battery Trays: Full-area DMC codes withstand 600°C/1h and 96hr salt spray.

  • Aerospace: Ti6Al4V engraving achieves Ra<0.8μm, compliant with AS9100D.

  • FPC Processing: 30±2μm UV cuts with zero carbonization.

KeyGree sets new benchmarks in industrial marking through opto-mechatronic integration. Future R&D will focus on ultrafast (ps/fs) and high-power (>500W) fiber lasers for semiconductor applications.